Process variations in microsystems manufacturing
By: Huff, Michael.
Series: Microsystems and Nanosystems. / edited by Roger T. Howe.Publisher: Switzerland Springer 2020Description: xix, 521p.ISBN: 9783030405588.Subject(s): Microelectromechanical systems | Manufactures | NanotechnologyDDC classification: 621.381 | H872p Summary: This book thoroughly examines and explains the basic processing steps used in MEMS fabrication (both integrated circuit and specialized micro machining processing steps. The book places an emphasis on the process variations in the device dimensions resulting from these commonly used processing steps. This will be followed by coverage of commonly used metrology methods, process integration and variations in material properties, device parameter variations, quality assurance and control methods, and design methods for handling process variations. A detailed analysis of future methods for improved microsystems manufacturing is also included. This book is a valuable resource for practitioners, researchers and engineers working in the field as well as students at either the undergraduate or graduate level.Item type | Current location | Collection | Call number | Status | Date due | Barcode | Item holds |
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Books | PK Kelkar Library, IIT Kanpur | General Stacks | 621.381 H872p (Browse shelf) | Available | A185439 |
Browsing PK Kelkar Library, IIT Kanpur Shelves , Collection code: General Stacks Close shelf browser
621.381 H785a2 cop.3 The art of electronics [2nd ed.] | 621.381 H785a2 cop.32 The art of electronics [2nd ed.] | 621.381 H859m2 MEMS and microsystems | 621.381 H872p Process variations in microsystems manufacturing | 621.381 Ia6p Practical guide to RF-MEMS | 621.381 IN8 INTRODUCTION TO MOLECULAR ELECTRONICS | 621.381 IR2E ELECTRONIC MATERIALS SCIENCE |
This book thoroughly examines and explains the basic processing steps used in MEMS fabrication (both integrated circuit and specialized micro machining processing steps. The book places an emphasis on the process variations in the device dimensions resulting from these commonly used processing steps. This will be followed by coverage of commonly used metrology methods, process integration and variations in material properties, device parameter variations, quality assurance and control methods, and design methods for handling process variations. A detailed analysis of future methods for improved microsystems manufacturing is also included. This book is a valuable resource for practitioners, researchers and engineers working in the field as well as students at either the undergraduate or graduate level.
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