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Process variations in microsystems manufacturing

By: Huff, Michael.
Series: Microsystems and Nanosystems. / edited by Roger T. Howe.Publisher: Switzerland Springer 2020Description: xix, 521p.ISBN: 9783030405588.Subject(s): Microelectromechanical systems | Manufactures | NanotechnologyDDC classification: 621.381 | H872p Summary: This book thoroughly examines and explains the basic processing steps used in MEMS fabrication (both integrated circuit and specialized micro machining processing steps. The book places an emphasis on the process variations in the device dimensions resulting from these commonly used processing steps. This will be followed by coverage of commonly used metrology methods, process integration and variations in material properties, device parameter variations, quality assurance and control methods, and design methods for handling process variations. A detailed analysis of future methods for improved microsystems manufacturing is also included. This book is a valuable resource for practitioners, researchers and engineers working in the field as well as students at either the undergraduate or graduate level.
List(s) this item appears in: New arrival Dec.13 to 19, 2021
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Item type Current location Collection Call number Status Date due Barcode Item holds
Books Books PK Kelkar Library, IIT Kanpur
General Stacks 621.381 H872p (Browse shelf) Available A185439
Total holds: 0

This book thoroughly examines and explains the basic processing steps used in MEMS fabrication (both integrated circuit and specialized micro machining processing steps. The book places an emphasis on the process variations in the device dimensions resulting from these commonly used processing steps. This will be followed by coverage of commonly used metrology methods, process integration and variations in material properties, device parameter variations, quality assurance and control methods, and design methods for handling process variations. A detailed analysis of future methods for improved microsystems manufacturing is also included. This book is a valuable resource for practitioners, researchers and engineers working in the field as well as students at either the undergraduate or graduate level.

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