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Welcome to P K Kelkar Library, Online Public Access Catalogue (OPAC)

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1.
MICROELECTRONICS PACKAGING HANDBOOK

by Rao R Tummala,Eugene J Rymaszewski,Alan G Klopfenstein | Klopfenstein,Alan G.

Edition: 2ndMaterial type: book Book; Format: print ; Literary form: not fiction Publisher: Chapman & Hall,New York 1997Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 M583T2] (1).

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2.
MICROELECTRONICS PACKAGING HANDBOOK

by Rao R Tummala,Eugene J Rymaszewski,Alan G Klopfenstein | Klopfenstein,Alan G.

Edition: 2ndMaterial type: book Book; Format: print ; Literary form: not fiction Description: 3.Publisher: Kluwer Academic Publishers, Dordrecht 1997Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 M583T2] (1).

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3.
FUNDAMENTALS OF MICROFABRICATION

by Madou,Marc.

Material type: book Book; Format: print ; Literary form: not fiction Description: 581.Publisher: Crc Press, Boca Raton 1997Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.38152 M266F] (1).

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4.
MICROELECTRONIC PACKAGING

by Datta,M.,Osaka,T | Schultze,J. W.

Material type: book Book; Format: print ; Literary form: not fiction Description: xix,542.Publisher: Crc Press, Boca Raton 2005Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 M583] (1).

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5.
ADVANCED ELECTRONIC PACKAGING

by Ulrich,Richard K | Brown,William D.

Edition: 2ndMaterial type: book Book; Format: print ; Literary form: not fiction Description: xxvi,812.Publisher: John Wiley & Sons, New Jersey 2006Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 AD95U2] (1).

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6.
3D IC stacking technology

by Wu, Banqiu | Kumar, Ajay.

Material type: book Book; Format: print ; Literary form: not fiction Description: xviii, 521p.Publisher: New York Mcgraw-Hill 2011Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.38153 W95t] (1).

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7.
INTEGRATION AND PACKAGING OF MEMS, NEMS AND ELECTRONIC SYSTEMS, INTERPACK2005 (CD ROM ONLY)

Description: .Publisher: American Society Of Mechanical Engineers, New York Availability: Items available for reference: PK Kelkar Library, IIT Kanpur [Call number: 621.381 AM35I] (1).

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8.
Substrate integrated antennas and arrays

by Cheng, Yu Jian.

Material type: book Book; Format: print ; Literary form: not fiction Description: xi, 250p.Publisher: Boca Raton: CRC Press, c2016Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.3824 C421s ] (1).

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9.
Three-dimensional integration and modeling : a revolution in RF and wireless packaging / : [electronic resource] :

by Lee, Jong-Hoon | Tentzeris, Manos M.

Material type: book Book; Format: available online remote; Literary form: not fiction ; Audience: Specialized; Description: 1 electronic text (x, 108 p. : ill. (some col.)) : digital file.Publisher: San Rafael, Calif. (1537 Fourth Street, San Rafael, CA 94901 USA) : Morgan & Claypool Publishers, c2008Online access: Abstract with links to resource | Abstract with links to full text Availability: Items available for loan: PK Kelkar Library, IIT Kanpur (1).

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