MICROELECTRONICS PACKAGING HANDBOOK
By: Rao R Tummala,Eugene J Rymaszewski,Alan G Klopfenstein.
Contributor(s): Klopfenstein,Alan G.
Material type:![materialTypeLabel](/opac-tmpl/lib/famfamfam/BK.png)
Item type | Current location | Collection | Call number | url | Status | Date due | Barcode | Item holds |
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PK Kelkar Library, IIT Kanpur | COMPACT STORAGE (BASEMENT) | 621.381046 M583T2 (Browse shelf) | Book Request | Available | A130594 |
Total holds: 0
Contents: Pt.1. Technology Drivers -- Pt.2. Semiconductor Packaging -- Pt.3. Subystem Packaging.
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