Three-dimensional integration and modeling : a revolution in RF and wireless packaging /
By: Lee, Jong-Hoon.
Contributor(s): Tentzeris, Manos M.
Material type:
BookSeries: Synthesis lectures on computational electromagnetics: #17.Publisher: San Rafael, Calif. (1537 Fourth Street, San Rafael, CA 94901 USA) : Morgan & Claypool Publishers, c2008Description: 1 electronic text (x, 108 p. : ill. (some col.)) : digital file.ISBN: 1598292455 (electronic bk.); 9781598292459 (electronic bk.); 1598292447 (pbk.); 9781598292442 (pbk.).Uniform titles: Synthesis digital library of engineering and computer science. Subject(s): Microelectronic packaging | Millimeter wave communication systems | Wireless communication systems | Three dimensional integration | Bandpass filter | Antenna | Low-temperature co-fired ceramic | Liquid crystal polymer organics | Ceramics | Soft surfaces | Front-end modules | Front-end module | Transceiver | Patch resonator | Gigabit | Dual-mode | Cavity | Millimeter wave | V-band | 60 GHzDDC classification: 621.381046 Online resources: Abstract with links to resource | Abstract with links to full text Also available in print.| Item type | Current location | Call number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|
E books
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PK Kelkar Library, IIT Kanpur | Available | EBKE038 |
Mode of access: World Wide Web.
System requirements: Adobe Acrobat reader.
Part of: Synthesis digital library of engineering and computer science.
Series from website.
Includes bibliographical references (p. 99-106).
Abstract -- Keywords -- 1. Introduction -- 2. Background on technologies for millimeter-wave passive front-ends -- 2.1. 3D Integrated SOP concept -- 2.2. LTCC multilayer technology -- 2.3. 60 GHz transmitter/receiver modules -- 3. Three-dimensional packaging in multilayer organic substrates -- 3.1. Multilayer LCP substrates -- 3.2. RF MEMS packaging using multilayer LCP substrates -- 3.3. Active device packaging using multilayer LCP substrates -- 3.4. Three-dimensional paper-based modules for RFID/sensing applications -- 4. Microstrip-type integrated passives -- 4.1. Patch resonator filters and duplexers -- 4.2. Quasielliptic filter -- 5. Cavity-type integrated passives -- 5.1. Rectangular cavity resonator -- 5.2. Three-pole cavity filters -- 5.3. Vertically stacked cavity filters and duplexers -- 5.4. Cavity-based dual-mode filters -- 6. Three-dimensional antenna architectures -- 6.1. Patch antenna using a soft-surface structure -- 6.2. High-gain patch antenna using soft-surface structure and stacked cavity -- 6.3. Dual-polarized cross-shaped microstrip antenna -- 6.4. Series-fed antenna array -- 7. Fully integrated three-dimensional passive front-ends -- 7.1. Passive front-ends for 60 GHz time-division duplexing (TDD) applications -- 7.2. Passive front-ends for 60 GHz frequency-division duplexing applications -- References.
Abstract freely available; full-text restricted to subscribers or individual document purchasers.
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This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.
Also available in print.
Title from PDF t.p. (viewed Oct. 19, 2008).
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