PKK Library catalog › Results of search for 'su:{Three-dimensional integrated circuits}'

	1.	3D IC stacking technology by Wu, Banqiu \| Kumar, Ajay. Material type: Book; Format: print ; Literary form: not fiction Description: xviii, 521p.Publisher: New York Mcgraw-Hill 2011Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.38153 W95t] (1). Place hold Add to cart (remove)
	2.	Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC by Li, Er-Ping. Material type: Book; Format: print ; Literary form: not fiction Description: xiv, 366p.Publisher: New Jersey John Wiley & Sons 2012Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.3815 L612e] (1). Place hold Add to cart (remove)
	3.	Die-stacking architecture / by Xie, Yuan 1973-, [author.] \| Zhao, Jishen [author.]. Material type: Book; Format: available online ; Literary form: not fiction ; Audience: Specialized; Description: 1 PDF (xiii, 113 pages) : illustrations.Publisher: San Rafael, California (1537 Fourth Street, San Rafael, CA 94901 USA) : Morgan & Claypool, 2015.Online access: Abstract with links to resource Availability: Items available for loan: PK Kelkar Library, IIT Kanpur (1). Place hold Add to cart (remove)

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