Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
By: Li, Er-Ping.
Material type:
BookPublisher: New Jersey John Wiley & Sons 2012Description: xiv, 366p.ISBN: 9780470623466.Subject(s): Three-dimensional integrated circuitsDDC classification: 621.3815 | L612e
| Item type | Current location | Collection | Call number | url | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|---|
Books
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PK Kelkar Library, IIT Kanpur | COMPACT STORAGE (BASEMENT) | 621.3815 L612e (Browse shelf) | Book Request | Available | A176030 |
Total holds: 0
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