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1. Wire bonding in microelectronics

by Harman, George.

Edition: 3rdMaterial type: book Book; Format: print ; Literary form: not fiction Description: xx, 426p.Publisher: New York Mcgraw-Hill 2010Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.3815 H227w3] (1).

2. Wire bonding in microelectronics [Electronic resource]

by Harman, George.

Material type: visual material Visual material Publisher: New York Mcgraw-Hill [2010]Availability: Items available for reference: PK Kelkar Library, IIT Kanpur [Call number: A172371 GA4.1] (1).

3. MICROELECTRONIC ULTRASONIC BONDING

by George G. Harman | Harman,George G.

Material type: book Book Description: 102.Publisher: U.S. Department Of Commerce, Washington 1974Availability: Items available for reference: PK Kelkar Library, IIT Kanpur [Call number: TR NB-400] (1).

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