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Wire bonding in microelectronics

By: Harman, George.
Material type: materialTypeLabelBookPublisher: New York Mcgraw-Hill 2010Edition: 3rd.Description: xx, 426p.ISBN: 9780071476232.Subject(s): MicroelectronicsDDC classification: 621.3815 | H227w3
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Item type Current location Collection Call number url Status Date due Barcode Item holds
Books Books PK Kelkar Library, IIT Kanpur
COMPACT STORAGE (BASEMENT) 621.3815 H227w3 (Browse shelf) Book Request Available A172371
Total holds: 0

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