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1.
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PACKAGING
by Crouwel, Wim | Weidemann, Kurt. Material type:  Book Description: 188.Publisher: New York Praeger c1968Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.7 C884p] (1).
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2.
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SCIENCE AND TECHNOLOGY OF AEROSAL PACKAGING
by Sciarra, John J | Stoller, Leonard. Material type: Book; Format:
print
; Literary form:
not fiction
Description: 710.Publisher: New York John Wiley 1974Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.757 Sc12] (1).
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3.
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GUIDE TO THERMOFORMED PLASTIC PACKAGING
by Farnham, Stanley E. Material type: Book; Format:
print
; Literary form:
not fiction
Description: 258.Publisher: Boston Cahners Books 1972Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 668.423 F234] (1).
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4.
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HANDBOOK OF PACKAGE ENGINEERING
by Hanlon, Joseph F. Edition: 2ndMaterial type: Book; Format:
print
; Literary form:
not fiction
Description: various paging.Publisher: New York Mcgraw-Hill 1984Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 688.8 H195h2] (1).
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5.
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PACKAGING OF POWER SEMICONDUCTOR DEVICES
by Neugebauer, C. A. Material type: Book; Format:
print
; Literary form:
not fiction
Description: viii,86.Publisher: New York Gordon And Breach 1986Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.38152 P12] (1).
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6.
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HANDBOOK OF PACKAGE ENGINEERING
by Hanton, Joseph F. Edition: 2ndMaterial type: Book; Format:
print
; Literary form:
not fiction
Description: 1 v.Publisher: New York Mcgraw-Hill 1984Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 658.7884 H195h2] (1).
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7.
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HANDBOOK OF ELECTRONICS PACKAGING DESIGN AND ENGINEERING
by Matisoff, Bernard S. Edition: 2ndMaterial type: Book Description: x,656.Publisher: New York Van Nostrand Reinhold c1990Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 M427h2] (1).
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8.
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Electronic materials handbook
by Dostal, Cyril A [ed.]. Material type: Book Description: xiv, 1209p.Publisher: Ohio Asm International 1989Availability: Items available for reference: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 Am35e v.1] (1).
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9.
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INTEGRATED PACKAGING SYSTEMS FOR TRANSPORTATION AND DISTRIBUTION
by Ebeling, Charles W. Material type: Book Description: viii,269.Publisher: New York Marcel Dekker c1990Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 658.564 Eb33i] (1).
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10.
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CHARACTERIZATION OF INTEGRATED CIRCUIT PACKAGING MATERIALS
by Thomas M. Moore,Robert G. Mckenna | Mckenna,Robert G. Material type: Book Description: xviii 274.Publisher: Butterworth-Heinemann, Boston c1993Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 C37] (1).
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11.
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PLASTICS FOR ELECTRONICS
by Alvino,William M. Material type: Book Description: xiii,363.Publisher: Mcgraw-Hill, New York c1995Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 620.1920246213 AL88P] (1).
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12.
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CIRCUITS, INTERCONNECTIONS AND PACKING FOR VLSI
by Bakoglu, H. B. Material type: Book Description: xiv,527.Publisher: Reading, Mass. Addison-Wesley c1990Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.38173 B179c] (1).
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13.
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AIR COOLING TECHNOLOGY FOR ELECTRONIC EQUIPMENT
by Sung Jin Kim,Sang Woo Lee | Lee,Sang Woo. Material type: Book Description: 251.Publisher: Crc Press, Boca Raton, Fl. c1996Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 AI71K] (1).
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14.
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THERMAL MANAGEMENT HANDBOOK FOR ELECTRONIC ASSEMBLIES
by Sergent,Jerry E | Krum,Al. Material type: Book; Format:
print
; Literary form:
not fiction
Publisher: Mcgraw-Hill, New York 1998Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381 SE66T] (1).
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15.
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MICROELECTRONICS PACKAGING HANDBOOK
by Rao R Tummala,Eugene J Rymaszewski,Alan G Klopfenstein | Klopfenstein,Alan G. Edition: 2ndMaterial type: Book; Format:
print
; Literary form:
not fiction
Publisher: Chapman & Hall,New York 1997Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 M583T2] (1).
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16.
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MICROELECTRONICS PACKAGING HANDBOOK
by Rao R Tummala,Eugene J Rymaszewski,Alan G Klopfenstein | Klopfenstein,Alan G. Edition: 2ndMaterial type: Book; Format:
print
; Literary form:
not fiction
Description: 2.Publisher: Kluwer Academic Publishers, Dordrecht 1997Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 M583T2] (1).
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17.
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MICROELECTRONICS PACKAGING HANDBOOK
by Rao R Tummala,Eugene J Rymaszewski,Alan G Klopfenstein | Klopfenstein,Alan G. Edition: 2ndMaterial type: Book; Format:
print
; Literary form:
not fiction
Description: 3.Publisher: Kluwer Academic Publishers, Dordrecht 1997Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 M583T2] (1).
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18.
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MANUFACTURING CHALLENGES IN ELECTRONIC PACKAGING
by Lee,Y C | Chen,W T. Material type: Book; Format:
print
; Literary form:
not fiction
Description: xi,261.Publisher: Chapman & Hall, London 1998Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 L516M] (1).
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19.
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THE ELECTRONIC PACKAGING HANDBOOK
by Glenn R Blackwell | Blackwell,Glenn R. Material type: Book Description: x.Publisher: Crc Press, Boca Raton c2000Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 EL11] (1).
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20.
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HANDBOOK FOR CRITICAL CLEANING
by Barbara No Kanegsberg,Edward No Kanegsberg | Kanegsberg,Edward. Material type: Book; Format:
print
; Literary form:
not fiction
Description: 658.Publisher: Crc Press, Boca Raton 2001Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 H191C] (1).
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