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Encyclopedia of thermal packaging [4 volume set] : a guide to cooling of electronic equipment: thermal packaging tools

Contributor(s): Bar-Cohen, Avram [ed.].
Material type: materialTypeLabelBookPublisher: New Jersey World Scientific 2012Description: various pagings.ISBN: 9789814327602.Subject(s): Insulation (Heat) | Electronic packagingDDC classification: 621.381046 | En19
Contents:
Contents: v. 1. Cooling of microelectronic and nanoelectronic equipment: advances and emerging research -- v. 2. Energy optimization and thermal management of data centres -- v. 3. Compact thermal models of electronic components -- v. 4. Thermally-Informed design of microelectronic components.
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Item type Current location Collection Call number Vol info Status Date due Barcode Item holds
Reference Reference PK Kelkar Library, IIT Kanpur
Reference 621.381046 En19 v.1 (Browse shelf) v.1. Cooling of microelectronic and nanoelectronic equipment: advances and emerging research Reference A180823
Reference Reference PK Kelkar Library, IIT Kanpur
Reference 621.381046 En19 v.2 (Browse shelf) v.2. Energy optimization and thermal management of data centres Reference A180824
Reference Reference PK Kelkar Library, IIT Kanpur
Reference 621.381046 En19 v.3 (Browse shelf) v.3. Compact thermal models of electronic components Reference A180825
Reference Reference PK Kelkar Library, IIT Kanpur
Reference 621.381046 En19v.4 (Browse shelf) v.4. Thermally-Informed design of microelectronic components. Reference A180826
Total holds: 0

Contents: v. 1. Cooling of microelectronic and nanoelectronic equipment: advances and emerging research -- v. 2. Energy optimization and thermal management of data centres -- v. 3. Compact thermal models of electronic components -- v. 4. Thermally-Informed design of microelectronic components.

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