Encyclopedia of thermal packaging [4 volume set] (Record no. 370290)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 00936pam a2200205a 44500 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20181113123546.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 160408b2012 xxu||||| |||| 00| 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9789814327602 |
| 040 ## - CATALOGING SOURCE | |
| Transcribing agency | IIT Kanpur |
| 041 ## - LANGUAGE CODE | |
| Language code of text/sound track or separate title | eng |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381046 |
| Item number | En19 |
| 245 1# - TITLE STATEMENT | |
| Title | Encyclopedia of thermal packaging [4 volume set] |
| Remainder of title | a guide to cooling of electronic equipment: thermal packaging tools |
| Statement of responsibility, etc | edited by Avram Bar-Cohen |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication | New Jersey |
| Name of publisher | World Scientific |
| Year of publication | 2012 |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | various pagings |
| 505 ## - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Contents: v. 1. Cooling of microelectronic and nanoelectronic equipment: advances and emerging research -- v. 2. Energy optimization and thermal management of data centres -- v. 3. Compact thermal models of electronic components -- v. 4. Thermally-Informed design of microelectronic components. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical Term | Insulation (Heat) |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical Term | Electronic packaging |
| 700 ## - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Bar-Cohen, Avram [ed.] |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | Reference |
| Withdrawn status | Lost status | Damaged status | Not for loan | Collection code | Permanent Location | Current Location | Date acquired | Source of acquisition | Cost, normal purchase price | Serial Enumeration / chronology | Full call number | Accession Number | Cost, replacement price | Koha item type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Reference | Reference | PK Kelkar Library, IIT Kanpur | PK Kelkar Library, IIT Kanpur | 2014-05-12 | International Book Agency | 21593.55 | v.4. Thermally-Informed design of microelectronic components. | 621.381046 En19v.4 | A180826 | 4318.71 | Reference | |||
| Reference | Reference | PK Kelkar Library, IIT Kanpur | PK Kelkar Library, IIT Kanpur | 2014-05-12 | International Book Agency | 21593.55 | v.3. Compact thermal models of electronic components | 621.381046 En19 v.3 | A180825 | 4318.71 | Reference | |||
| Reference | Reference | PK Kelkar Library, IIT Kanpur | PK Kelkar Library, IIT Kanpur | 2014-05-12 | International Book Agency | 21593.55 | v.2. Energy optimization and thermal management of data centres | 621.381046 En19 v.2 | A180824 | 4318.71 | Reference | |||
| Reference | Reference | PK Kelkar Library, IIT Kanpur | PK Kelkar Library, IIT Kanpur | 2014-05-12 | International Book Agency | 21593.55 | v.1. Cooling of microelectronic and nanoelectronic equipment: advances and emerging research | 621.381046 En19 v.1 | A180823 | 4318.71 | Reference |