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Wire bonding in microelectronics

By: Harman, George.
Material type: materialTypeLabelBookPublisher: New York Mcgraw-Hill 2010Edition: 3rd.Description: xx, 426p.ISBN: 9780071476232.Subject(s): MicroelectronicsDDC classification: 621.3815 | H227w3
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Item type Current location Collection Call number url Status Date due Barcode Item holds
Books Books PK Kelkar Library, IIT Kanpur
COMPACT STORAGE (BASEMENT) 621.3815 H227w3 (Browse shelf) Book Request Available A172371
Total holds: 0
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621.3815 H191 Handbook of algorithms for physical design automation 621.3815 H198m MICROWAVE SCANNING ANTENNAS 621.3815 H198m MICROWAVE SCANNING ANTENNAS 621.3815 H227w3 Wire bonding in microelectronics 621.3815 H24v VACUUM AND SOLID STATE ELECTRONICS 621.3815 H29c CIRCUIT THEORY OF LINEAR NOISY NETWORKS 621.3815 H29c CIRCUIT THEORY OF LINEAR NOISY NETWORKS

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