MICROELECTRONICS PACKAGING HANDBOOK
By: Rao R Tummala,Eugene J Rymaszewski,Alan G Klopfenstein.
Contributor(s): Klopfenstein,Alan G.
Material type:
BookPublisher: Chapman & Hall,New York 1997Edition: 2nd.ISBN: 0412084317.Subject(s): Microelectronic Packaging -- Handbook, Manuals, EtcDDC classification: 621.381046 | M583T2
| Item type | Current location | Collection | Call number | url | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|---|
Books
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PK Kelkar Library, IIT Kanpur | COMPACT STORAGE (BASEMENT) | 621.381046 M583T2 (Browse shelf) | Book Request | Available | A130594 |
Total holds: 0
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| 621.381046 L74p Power electronic packaging | 621.381046 M199M MECHANICAL ANALYSIS OF ELECTRONIC PACKAGING SYSTEMS | 621.381046 M427h2 HANDBOOK OF ELECTRONICS PACKAGING DESIGN AND ENGINEERING | 621.381046 M583T2 MICROELECTRONICS PACKAGING HANDBOOK | 621.381046 M583T2 MICROELECTRONICS PACKAGING HANDBOOK | 621.381046 M583T2 MICROELECTRONICS PACKAGING HANDBOOK | 621.381046 N157 Nano-bio-electronic, photonic and MEMS packaging |
Contents: Pt.1. Technology Drivers -- Pt.2. Semiconductor Packaging -- Pt.3. Subystem Packaging.
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