| 000 | 00565pam a2200181a 44500 | ||
|---|---|---|---|
| 008 | 160408b2011 xxu||||| |||| 00| 0 eng d | ||
| 020 | _a9780071741958 | ||
| 040 | _aIIT, Kanpur | ||
| 082 |
_a621.38153 _bW95t |
||
| 100 | _aWu, Banqiu | ||
| 245 | 1 |
_a3D IC stacking technology _cBanqiu Wu, Ajay Kumar and Sesh Ramaswami |
|
| 260 |
_aNew York _bMcgraw-Hill _c2011 |
||
| 300 | _axviii, 521p | ||
| 650 | _aThree-dimensional integrated circuits | ||
| 650 | _aMicroelectronic packaging | ||
| 700 | _aKumar, Ajay | ||
| 997 | _aA173813 s C | ||
| 999 |
_c370760 _d370760 |
||