| 000 | 00936pam a2200205a 44500 | ||
|---|---|---|---|
| 005 | 20181113123546.0 | ||
| 008 | 160408b2012 xxu||||| |||| 00| 0 eng d | ||
| 020 | _a9789814327602 | ||
| 040 | _cIIT Kanpur | ||
| 041 | _aeng | ||
| 082 |
_a621.381046 _bEn19 |
||
| 245 | 1 |
_aEncyclopedia of thermal packaging [4 volume set] _ba guide to cooling of electronic equipment: thermal packaging tools _cedited by Avram Bar-Cohen |
|
| 260 |
_aNew Jersey _bWorld Scientific _c2012 |
||
| 300 | _avarious pagings | ||
| 505 | _aContents: v. 1. Cooling of microelectronic and nanoelectronic equipment: advances and emerging research -- v. 2. Energy optimization and thermal management of data centres -- v. 3. Compact thermal models of electronic components -- v. 4. Thermally-Informed design of microelectronic components. | ||
| 650 | _aInsulation (Heat) | ||
| 650 | _aElectronic packaging | ||
| 700 | _aBar-Cohen, Avram [ed.] | ||
| 942 | _cREF | ||
| 999 |
_c370290 _d370290 |
||