| 000 | 00489pam a2200169a 44500 | ||
|---|---|---|---|
| 008 | 160408b2008 xxu||||| |||| 00| 0 eng d | ||
| 020 | _a9783540766629 | ||
| 082 |
_a621.38152 _bR22 |
||
| 100 | _a | ||
| 245 | 1 |
_aReactive sputter deposition _cedited by D. Depla |
|
| 260 |
_aBerlin _bSpringer _c2008 |
||
| 300 | _axviii, 570p. | ||
| 440 |
_aSpringer Series In Materials Science _v |
||
| 650 | _aCathode Sputtering (Plating Process) | ||
| 700 | _aMahieu, S.,Ed. | ||
| 997 | _aA161826 s C | ||
| 999 |
_c361195 _d361195 |
||