| 000 | 00562pam a2200193a 44500 | ||
|---|---|---|---|
| 008 | 160408b1998 xxu||||| |||| 00| 0 eng d | ||
| 020 | _a0070228949 | ||
| 082 |
_a621.381 _bG194M |
||
| 100 | _aGarrou,Philip E. | ||
| 245 | 1 | _aMULTICHIP MODULE TECHNOLOGY HANDBOOK | |
| 260 |
_a _bMcgraw-Hill, New York _c1998 |
||
| 300 | _axxii, | ||
| 440 |
_aElectronic Packaging And Interconnection Series _v |
||
| 650 | _aMultichip Modules (Microelectronics) | ||
| 650 | _aMicroelecronic Packaging | ||
| 700 | _aTurlik,Iwona | ||
| 964 | _gCIRC | ||
| 997 | _aA154465 s C | ||
| 999 |
_c339560 _d339560 |
||