| 000 | 00633pam a2200181a 44500 | ||
|---|---|---|---|
| 008 | 160408b1997 xxu||||| |||| 00| 0 eng d | ||
| 020 | _a0412084317 | ||
| 082 |
_a621.381046 _bM583T2 |
||
| 100 | _aRao R Tummala,Eugene J Rymaszewski,Alan G Klopfenstein | ||
| 245 | 1 |
_aMICROELECTRONICS PACKAGING HANDBOOK _c0 |
|
| 250 | _a2nd | ||
| 260 |
_a _bChapman & Hall,New York _c1997 |
||
| 500 | _aContents: Pt.1. Technology Drivers -- Pt.2. Semiconductor Packaging -- Pt.3. Subystem Packaging. | ||
| 650 | _aMicroelectronic Packaging -- Handbook, Manuals, Etc | ||
| 700 | _aKlopfenstein,Alan G | ||
| 964 | _gCIRC | ||
| 997 | _aA130594 s C | ||
| 999 |
_c333697 _d333697 |
||