| 000 | 00458pam a2200157a 44500 | ||
|---|---|---|---|
| 008 | 160408b1989 xxu||||| |||| 00| 0 eng d | ||
| 020 | _a0841216797 | ||
| 082 |
_a621.381046 _bP769 |
||
| 100 | _aLupinski, John H. | ||
| 245 | 1 | _aPOLYMERIC MATERIALS FOR ELECTRONICS PACKAGING AND INTERCONNECTION | |
| 260 |
_aWashington, Dc. _bAmerican Chemical Society _c1989 |
||
| 300 | _axi,499 | ||
| 700 | _aMoore, Robert S. | ||
| 964 | _gCIRC | ||
| 997 | _aA109164 s C | ||
| 999 |
_c315352 _d315352 |
||