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1.
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PACKAGING OF POWER SEMICONDUCTOR DEVICES
by Neugebauer, C. A. Material type:  Book; Format:
print
; Literary form:
not fiction
Description: viii,86.Publisher: New York Gordon And Breach 1986Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.38152 P12] (1).
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2.
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HANDBOOK OF ELECTRONICS PACKAGING DESIGN AND ENGINEERING
by Matisoff, Bernard S. Edition: 2ndMaterial type: Book Description: x,656.Publisher: New York Van Nostrand Reinhold c1990Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 M427h2] (1).
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3.
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Electronic materials handbook
by Dostal, Cyril A [ed.]. Material type: Book Description: xiv, 1209p.Publisher: Ohio Asm International 1989Availability: Items available for reference: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 Am35e v.1] (1).
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4.
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CHARACTERIZATION OF INTEGRATED CIRCUIT PACKAGING MATERIALS
by Thomas M. Moore,Robert G. Mckenna | Mckenna,Robert G. Material type: Book Description: xviii 274.Publisher: Butterworth-Heinemann, Boston c1993Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 C37] (1).
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5.
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PLASTICS FOR ELECTRONICS
by Alvino,William M. Material type: Book Description: xiii,363.Publisher: Mcgraw-Hill, New York c1995Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 620.1920246213 AL88P] (1).
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6.
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CIRCUITS, INTERCONNECTIONS AND PACKING FOR VLSI
by Bakoglu, H. B. Material type: Book Description: xiv,527.Publisher: Reading, Mass. Addison-Wesley c1990Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.38173 B179c] (1).
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7.
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AIR COOLING TECHNOLOGY FOR ELECTRONIC EQUIPMENT
by Sung Jin Kim,Sang Woo Lee | Lee,Sang Woo. Material type: Book Description: 251.Publisher: Crc Press, Boca Raton, Fl. c1996Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 AI71K] (1).
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8.
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THERMAL MANAGEMENT HANDBOOK FOR ELECTRONIC ASSEMBLIES
by Sergent,Jerry E | Krum,Al. Material type: Book; Format:
print
; Literary form:
not fiction
Publisher: Mcgraw-Hill, New York 1998Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381 SE66T] (1).
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9.
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MANUFACTURING CHALLENGES IN ELECTRONIC PACKAGING
by Lee,Y C | Chen,W T. Material type: Book; Format:
print
; Literary form:
not fiction
Description: xi,261.Publisher: Chapman & Hall, London 1998Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 L516M] (1).
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10.
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THE ELECTRONIC PACKAGING HANDBOOK
by Glenn R Blackwell | Blackwell,Glenn R. Material type: Book Description: x.Publisher: Crc Press, Boca Raton c2000Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 EL11] (1).
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11.
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HANDBOOK FOR CRITICAL CLEANING
by Barbara No Kanegsberg,Edward No Kanegsberg | Kanegsberg,Edward. Material type: Book; Format:
print
; Literary form:
not fiction
Description: 658.Publisher: Crc Press, Boca Raton 2001Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 H191C] (1).
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12.
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ELECTRONIC PACKAGING
by Pecht,Michael G | Pecht,Michael G. Material type: Book Description: 114.Publisher: Crc Press, Boca Raton c1999Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 EL25] (1).
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13.
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PACKAGING OF ELECTRONIC SYSTEMS
by Dally,James W. Material type: Book; Format:
print
; Literary form:
not fiction
Description: xviii,441.Publisher: Mcgraw-Hill, New York 1990Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 D167P] (1).
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14.
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MECHANICAL ANALYSIS OF ELECTRONIC PACKAGING SYSTEMS
by Mckeown,Stephen A. Material type: Book; Format:
print
; Literary form:
not fiction
Description: ix,355.Publisher: Marcel Dekker, New York 1999Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 M199M] (1).
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15.
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MICROSCALE HEAT TRANSFER
: FUNDAMENTALS AND APPLICATIONS
by Kakac,S. Material type: Book; Format:
print
; Literary form:
not fiction
Description: viii,509.Publisher: Springer,Aa Dordrecht 2005Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 536.2 M583K] (1).
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16.
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CERAMIC INTERCONNECT TECHNOLOGY HANDBOOK
by Barlow Iii,Fred D | Elshabini,Aicha. Material type: Book; Format:
print
; Literary form:
not fiction
Description: 441.Publisher: Crc Press, Boca Raton 2007Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 C334] (1).
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17.
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Encyclopedia of thermal packaging [6 volume set]
: thermal packaging techinques
by Bar-Cohen, Avram [ed.]. Material type: Book; Format:
print
; Literary form:
not fiction
Description: various pagings.Publisher: New Jersey World Scientific World 2013Availability: Items available for reference: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 En19 v.2] (6).
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18.
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Encyclopedia of thermal packaging [4 volume set]
: a guide to cooling of electronic equipment: thermal packaging tools
by Bar-Cohen, Avram [ed.]. Material type: Book; Format:
print
; Literary form:
not fiction
Description: various pagings.Publisher: New Jersey World Scientific 2012Availability: Items available for reference: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 En19 v.1] (4).
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