PKK Library catalog › Results of search for 'su:{Electronic Packaging -- Materials}'

	1.	CHARACTERIZATION OF INTEGRATED CIRCUIT PACKAGING MATERIALS by Thomas M. Moore,Robert G. Mckenna \| Mckenna,Robert G. Material type: Book Description: xviii 274.Publisher: Butterworth-Heinemann, Boston c1993Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 C37] (1). Place hold Add to cart (remove)
	2.	PLASTICS FOR ELECTRONICS by Alvino,William M. Material type: Book Description: xiii,363.Publisher: Mcgraw-Hill, New York c1995Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 620.1920246213 AL88P] (1). Place hold Add to cart (remove)
	3.	ELECTRONIC PACKAGING by Pecht,Michael G \| Pecht,Michael G. Material type: Book Description: 114.Publisher: Crc Press, Boca Raton c1999Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 EL25] (1). Place hold Add to cart (remove)
	4.	CERAMIC INTERCONNECT TECHNOLOGY HANDBOOK by Barlow Iii,Fred D \| Elshabini,Aicha. Material type: Book; Format: print ; Literary form: not fiction Description: 441.Publisher: Crc Press, Boca Raton 2007Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 C334] (1). Place hold Add to cart (remove)

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