Power electronic packaging : design, assembly process, reliability and modeling
By: Liu, Yong.
Material type: BookPublisher: New York Springer Science+Business Media 2012Description: xviii, 591p.ISBN: 9781461410522.Subject(s): Power electronic -- Computer | Electromigration simulationDDC classification: 621.381046 | L74pItem type | Current location | Collection | Call number | url | Status | Date due | Barcode | Item holds |
---|---|---|---|---|---|---|---|---|
Books | PK Kelkar Library, IIT Kanpur | COMPACT STORAGE (BASEMENT) | 621.381046 L74p (Browse shelf) | Book Request | Available | A176594 |
Total holds: 0
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