POLYMERIC MATERIALS FOR ELECTRONICS PACKAGING AND INTERCONNECTION
By: Lupinski, John H.
Contributor(s): Moore, Robert S.
Material type: BookPublisher: Washington, Dc. American Chemical Society 1989Description: xi,499.ISBN: 0841216797.DDC classification: 621.381046 | P769Item type | Current location | Collection | Call number | url | Status | Date due | Barcode | Item holds |
---|---|---|---|---|---|---|---|---|
Books | PK Kelkar Library, IIT Kanpur | COMPACT STORAGE (BASEMENT) | 621.381046 P769 (Browse shelf) | Book Request | Available | A109164 |
Total holds: 0
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