3D IC stacking technology
By: Wu, Banqiu.
Contributor(s): Kumar, Ajay.
Material type:
BookPublisher: New York Mcgraw-Hill 2011Description: xviii, 521p.ISBN: 9780071741958.Subject(s): Three-dimensional integrated circuits | Microelectronic packagingDDC classification: 621.38153 | W95t
| Item type | Current location | Collection | Call number | url | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|---|
Books
|
PK Kelkar Library, IIT Kanpur | COMPACT STORAGE (BASEMENT) | 621.38153 W95t (Browse shelf) | Book Request | Available | A173813 |
Total holds: 0
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