High Thermal Conductivity Materials
Contributor(s): Shindé, Subhash L [editor.] | Goela, Jitendra S [editor.] | SpringerLink (Online service).
Material type:
BookPublisher: New York, NY : Springer New York, 2006.Description: XVIII, 271 p. 133 illus. online resource.Content type: text Media type: computer Carrier type: online resourceISBN: 9780387251004.Subject(s): Physics | Condensed matter | Materials science | Physics | Condensed Matter Physics | Characterization and Evaluation of MaterialsDDC classification: 530.41 Online resources: Click here to access online | Item type | Current location | Call number | Status | Date due | Barcode | Item holds |
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E books
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PK Kelkar Library, IIT Kanpur | Available | EBK6523 |
Lattice Thermal Conduction Mechanism in Solids -- High Lattice Thermal Conductivity Solids -- Thermal Characterization of the High-Thermal-Conductivity Dielectrics -- Thermal Wave Probing of High-Conductivity Heterogeneous Materials -- Fabrication of High-Thermal-Conductivity Polycrystalline Aluminum Nitride: Thermodynamic and Kinetic Aspects of Oxygen Removal -- High-Thermal-Conductivity SiC and Applications -- Chemical-Vapor-Deposited Diamond for High-Heat-Transfer Applications -- Unusually High Thermal Conductivity in Carbon Nanotubes.
Thermal management has become a ‘hot’ field in recent years due to a need to obtain high performance levels in many devices used in such diverse areas as space science, mainframe and desktop computers, optoelectronics and even Formula One racing cars! Thermal solutions require not just taking care of very high thermal flux, but also ‘hot spots’, where the flux densities can exceed 200 W/cm2. High thermal conductivity materials play an important role in addressing thermal management issues. This volume provides readers a basic understanding of the thermal conduction mechanisms in these materials and discusses how the thermal conductivity may be related to their crystal structures as well as microstructures developed as a result of their processing history. The techniques for accurate measurement of these properties on large as well as small scales have been reviewed. Detailed information on the thermal conductivity of diverse materials including aluminum nitride (AlN), silicon carbide (SiC), diamond, as well as carbon nanotubes has been presented. The emphasis is on developing basic understanding of the inter-relationships between thermal conductivity and processing such that the readers can conduct their own research in this exciting field of high thermal conductivity materials. Engineers and scientists involved in addressing thermal management issues in a broad spectrum of industries should find this book a valuable resource in their work.
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