Welcome to P K Kelkar Library, Online Public Access Catalogue (OPAC)

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1. ADVANCES IN THERMAL MODELING OF ELECTRONIC COMPONENTS AND SYSTEMS

by Bar-Cohen, Avram | Kraus, Allan D.

Material type: book Book; Format: print ; Literary form: not fiction Description: v.Publisher: New York Hemisphere 1988Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.4834 B34a] (1).

2. Encyclopedia of thermal packaging [6 volume set] : thermal packaging techinques

by Bar-Cohen, Avram [ed.].

Material type: book Book; Format: print ; Literary form: not fiction Description: various pagings.Publisher: New Jersey World Scientific World 2013Availability: Items available for reference: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 En19 v.2] (6).

3. Encyclopedia of thermal packaging [4 volume set] : a guide to cooling of electronic equipment: thermal packaging tools

by Bar-Cohen, Avram [ed.].

Material type: book Book; Format: print ; Literary form: not fiction Description: various pagings.Publisher: New Jersey World Scientific 2012Availability: Items available for reference: PK Kelkar Library, IIT Kanpur [Call number: 621.381046 En19 v.1] (4).

4. Convective flow and pool boiling : proceedings...

by 3rd. International engineering foundation conference Irsee Germany May 18th - 23rd, 1997 | Mayinger, Franz [ed.] | Lehner, Markus [ed.] | Bar-Cohen, Avram [asso. ed.] | Chen, John C. [asso. ed.] | Celata, G. P. [asso. ed.] | Fujita, Y. [asso. ed.].

Description: x, 448p.Publisher: London Taylor and Francis 1999Availability: Items available for loan: PK Kelkar Library, IIT Kanpur [Call number: 621.4025 In8c] (1).

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