621.38153  / W95t <br/>
Wu, Banqiu <br/>
       3D IC stacking technology 
 / Banqiu Wu, Ajay Kumar and Sesh Ramaswami 
 .- New York: Mcgraw-Hill,  2011 
 .- xviii, 521p . 
<br><u>ISBN:</u> 9780071741958 
<br/><u>Subject Headings:</u> <br/>Three-dimensional integrated circuits;<br/>Microelectronic packaging;
<br/><U>Author Added Entry: </u><br/>Kumar, Ajay;
<br><U>Copy Details:</u><br> Acc. No.: <b>A173813</b>, Full Call No.: 621.38153 W95t,   Item type:  Books , Location: COMPACT STORAGE (BASEMENT), <br><b>------------------------- --------------------- ------ --------- ------- ------- --------- -------- </b><br>