621.381046  / En19 <br/>
       Encyclopedia of thermal packaging [4 volume set] : a guide to cooling of electronic equipment: thermal packaging tools 
 / edited by Avram Bar-Cohen 
 .- New Jersey: World Scientific,  2012 
 .- various pagings. 
<br><u>ISBN:</u> 9789814327602 
<br/><u>Subject Headings:</u> <br/>Insulation (Heat);<br/>Electronic packaging;
<br/><U>Author Added Entry: </u><br/>Bar-Cohen, Avram [ed.];
<br><U>Copy Details:</u><br> Acc. No.: <b>A180826</b>, Full Call No.: 621.381046 En19v.4,   Item type:  Reference , Location: Reference, v.4. Thermally-Informed design of microelectronic components.<br><b>------------------------- --------------------- ------ --------- ------- ------- --------- -------- </b><br>Acc. No.: <b>A180825</b>, Full Call No.: 621.381046 En19 v.3,   Item type:  Reference , Location: Reference, v.3. Compact thermal models of electronic components <br><b>------------------------- --------------------- ------ --------- ------- ------- --------- -------- </b><br>Acc. No.: <b>A180824</b>, Full Call No.: 621.381046 En19 v.2,   Item type:  Reference , Location: Reference, v.2. Energy optimization and thermal management of data centres<br><b>------------------------- --------------------- ------ --------- ------- ------- --------- -------- </b><br>Acc. No.: <b>A180823</b>, Full Call No.: 621.381046 En19 v.1,   Item type:  Reference , Location: Reference, v.1. Cooling of microelectronic and nanoelectronic equipment: advances and emerging research<br><b>------------------------- --------------------- ------ --------- ------- ------- --------- -------- </b><br>