621.3815  / H227w3 <br/>
Harman, George <br/>
       Wire bonding in microelectronics 
 / George Harman 
 .- 3rd 
 .- New York: Mcgraw-Hill,  2010 
 .- xx, 426p . 
<br><u>ISBN:</u> 9780071476232 
<br/><u>Subject Headings:</u> <br/>Microelectronics;
<br><U>Copy Details:</u><br> Acc. No.: <b>A172371</b>, Full Call No.: 621.3815 H227w3,   Item type:  Books , Location: COMPACT STORAGE (BASEMENT), <br><b>------------------------- --------------------- ------ --------- ------- ------- --------- -------- </b><br>