621.381046 / M583T2
Rao R Tummala,Eugene J Rymaszewski,Alan G Klopfenstein
MICROELECTRONICS PACKAGING HANDBOOK
/ 0
.- 2nd
.- Chapman & Hall,New York, 1997
Contents: Pt.1. Technology Drivers -- Pt.2. Semiconductor Packaging -- Pt.3. Subystem Packaging.
ISBN: 0412084317
Subject Headings:
Microelectronic Packaging -- Handbook, Manuals, Etc;
Author Added Entry:
Klopfenstein,Alan G;
Copy Details:
Acc. No.: A130594, Full Call No.: 621.381046 M583T2, Item type: Books , Location: COMPACT STORAGE (BASEMENT),
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