621.381046  / P769 <br/>
Lupinski, John H. <br/>
       POLYMERIC MATERIALS FOR ELECTRONICS PACKAGING AND INTERCONNECTION 
 / 
 .- Washington, Dc.: American Chemical Society,  1989 
 .- xi,499 . 
<br><u>ISBN:</u> 0841216797 
<br/><U>Author Added Entry: </u><br/>Moore, Robert S.;
<br><U>Copy Details:</u><br> Acc. No.: <b>A109164</b>, Full Call No.: 621.381046 P769,   Item type:  Books , Location: COMPACT STORAGE (BASEMENT), <br><b>------------------------- --------------------- ------ --------- ------- ------- --------- -------- </b><br>