Development of measurement capability for micro-vibration evaluation with application to chip fabrication facilities
Contributor(s): Lee, G. C | Liang, Z | Song, J. W | Shen, J. D.
Material type:
BookSeries: Technical report Multidisciplinary Center for Earthquake Engineering Research [MCEER]. MCEER-99-0020, December 1, 1999.Publisher: Buffalo, New York Multidisciplinary Center for Earthquake Engineering Research, University at Buffalo 1999Description: xiii, 129p.ISSN: 1520-295X.Subject(s): Fabrication | Technical reportDDC classification: 624.1762
| Item type | Current location | Collection | Call number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|
Technical Report
|
PK Kelkar Library, IIT Kanpur | General Stacks | 624.1762 MCEER-99-0020 (Browse shelf) | Reference | TR21402 |
Total holds: 0
This research was conducted at the University at Buffalo, State University of New York and was supported in whole or in part by the National Science Foundation under Grant No. CMS 97-01471 and other sponsors.
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