Optical interconnects
By: Chen, Ray T.
Contributor(s): Choi, Chulchae.
Material type:
BookSeries: Synthesis lectures on solid state materials and devices: #2.Publisher: San Rafael, Calif. (1537 Fourth Street, San Rafael, CA 94901 USA) : Morgan & Claypool Publishers, c2007Edition: 1st ed.Description: 1 electronic text (xi, 91 p.) : digital file.ISBN: 9781598290660 (pbk.); 1598290665 (pbk.); 9781598290677 (electronic bk.); 1598290673 (electronic bk.).Uniform titles: Synthesis digital library of engineering and computer science. Subject(s): Multichip modules (Microelectronics) | Integrated circuits -- Very large scale integration | Printed circuits | Semiconductor lasers | Optical interconnects | Fully embedded optical interconnection | Vertical cavity surface emitting laser (VCSEL) | Optical interconnection layer | Printed circuit board (PCB) | Multichip modules (MCM) | Very large scale integrated (VLSI) circuits to ultra large scale integrated (ULSI) circuitsDDC classification: 621.36/93 Online resources: Abstract with links to resource | Abstract with links to resource Also available in print.| Item type | Current location | Call number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|
E books
|
PK Kelkar Library, IIT Kanpur | Available | EBKE016 |
Mode of access: World Wide Web.
System requirements: Adobe Acrobat Reader.
Part of : Synthesis digital library of engineering and computer science.
Series from website.
Includes bibliographical references (p. 87-91).
Introduction -- Motivation -- Overview of optical interconnects -- Fully embedded board level optical interconnects -- Chapter organization -- Thinned vertical cavity surface emitting laser fabrication -- Design of an epitaxial layer structure -- Fabrication of the vertical cavity surface emitting laser -- VCSEL characterization -- Electrical and optical characteristics -- High-speed modulation characteristics -- Thermal resistance -- Thermal management of embedded VCSEL -- Two dimensional finite element analysis -- Optical interconnection layer -- Waveguide micromirror coupler -- Soft molding -- Propagation loss measurement -- System integration -- Integration of thin-film VCSEL and detector arrays on oil -- Hybrid integration of oil and printed circuit board -- Summary -- Effects of thermal-via structures on thin film VCSELs for a fully embedded board-level optical interconnection system -- Fabrication of a thin film VCSEL and measurement of thermal resistance (Rth) -- Numerical modeling of self-heating effect for a thin film VCSEL -- Thermal-via structures for the fully embedded thin film VCSEL -- Conclusion -- Acknowledgments.
Abstract freely available; full-text restricted to subscribers or individual document purchasers.
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This book describes a fully embedded board level optical interconnects in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of mentioned devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.
Also available in print.
Title from PDF t.p. (viewed on Oct. 27, 2008).
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