Advanced polyimide materials : synthesis, characterization and applications
Contributor(s): Yang, Shi-Yong [ed.].
Series: A chemical industry press series on advanced electronic packaging technology and key materials / edited by C. P. Wong and Wenhui Zhu. Publisher: Amsterdam Elsevier 2018Description: xiv, 483p.ISBN: 9780128126400.Subject(s): Polymer scienceDDC classification: 668.9 | Ad95 Summary: Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. Reviews the latest research, development and future prospective of polyimides Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers Presents a highly organized work that is composed of different sections that are easily compared| Item type | Current location | Collection | Call number | Status | Date due | Barcode | Item holds |
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PK Kelkar Library, IIT Kanpur | General Stacks | 668.9 Ad95 (Browse shelf) | Available | A183731 |
Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research.
The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation.
Reviews the latest research, development and future prospective of polyimides
Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers
Presents a highly organized work that is composed of different sections that are easily compared
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