ELECTROLESS NICKEL PLATING FOR MAKING OHMIC CONTACTS TO SILICON
By: Sullivan,M V.
Contributor(s): Eigler,J H.
Material type:
BookPublisher: Jet Propulsion Laboratory, Pasadena, California 1957Description: 4.DDC classification: BTS | MONO 2808
| Item type | Current location | Collection | Call number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|
Technical Report
|
PK Kelkar Library, IIT Kanpur | General Stacks | BTS MONO 2808 (Browse shelf) | Not for loan | TR18382 |
Total holds: 0
Browsing PK Kelkar Library, IIT Kanpur Shelves , Collection code: General Stacks Close shelf browser
| BTS MONO 2804 EFFECTS OF MONOLAYER ABSORPTION AN EJECTION OF ELECTRON FROM METALS | BTS MONO 2805 DEPTH OF SURFACE DAMAGE DUE TO ABRASION ON GERMANIUM | BTS MONO 2807 STANDRAD SALT-SPRAY TEST-IS IT A VALID ACCEPTANCE TEST ? | BTS MONO 2808 ELECTROLESS NICKEL PLATING FOR MAKING OHMIC CONTACTS TO SILICON | BTS MONO 2809 AGING OF NEOPRENE IN A WEATHEROMETER | BTS MONO 2810 EXPERIMENTAL EVALUATION OF RELIABILITY OF SOLDERLESS WRAPPED CONNECTIONS | BTS MONO 2811 SILICON DIFFUSED JUNCTION "AVALANCHE "DIODES |
Bound With Bts Mono 2801-2807,2809-2825 Lack No 2806
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