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LEED STUDY OF THE ADHESION OF GOLD TO COPPER AND COPPER-ALUMINUM ALLOYS

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BookPublisher: Nasa, Washington, D.C. 1969Description: 22.DDC classification: NASA | TN D-5351 -

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Item type	Current location	Collection	Call number	Status	Date due	Barcode	Item holds
Technical Report	PK Kelkar Library, IIT Kanpur	General Stacks	NASA TN D-5351 - (Browse shelf)	Not for loan		TR8274

Total holds: 0

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Previous	NASA TN D-5349 - FRICTION AND CONTACT RESISTANCE DURING SLIDING IN VACUUM OF SOME LOW-RESISTIVITY METALS LUBRICATED WITH SPUTTERED MOLYBDENUM DISULFIDE FILMS	NASA TN D-535 DAMAGE INCURRED ON A TILT-WING MULTIPROPELLER VTOL/STOL AIRCRAFT OPERATING OVER A LEVEL GARVEL-COVERED SURFACE.	NASA TN D-5350 - IMPLEMENTATION AND STRUCTURE OF COMPUTE, A TIME-SHARING CALCULATOR PROGRAM	NASA TN D-5351 - LEED STUDY OF THE ADHESION OF GOLD TO COPPER AND COPPER-ALUMINUM ALLOYS	NASA TN D-5352 - NICKEL BASE ALLOY, WAZ-20, WITH IMPROVED STRENGTH IN THE 2000(DEGREE) F RANGE	NASA TN D-5353 - SOLAR ABSORPTANCES AND SPECTRAL REFLECTANCES OF 12 METALS FOR TEMPERATURES RANGING FROM 300 TO 500 K	NASA TN D-5354 - TENSILE AND CYCLIC FATIGUE PROPERTIES OF GRAPHITE FILAMENT-WOUND PRESSURE VESSELS AT AMBIENT AND CRYOGENIC TEMPERATURES	Next

Bound With Nasa Tn D-5341-60

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