Power electronic packaging : design, assembly process, reliability and modeling
By: Liu, Yong.
Material type:![materialTypeLabel](/opac-tmpl/lib/famfamfam/BK.png)
Item type | Current location | Collection | Call number | url | Status | Date due | Barcode | Item holds |
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PK Kelkar Library, IIT Kanpur | COMPACT STORAGE (BASEMENT) | 621.381046 L74p (Browse shelf) | Book Request | Available | A176594 |
Total holds: 0
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621.381046 H191C HANDBOOK FOR CRITICAL CLEANING | 621.381046 J564i Introduction to microsystem packaging technology | 621.381046 L516M MANUFACTURING CHALLENGES IN ELECTRONIC PACKAGING | 621.381046 L74p Power electronic packaging | 621.381046 M199M MECHANICAL ANALYSIS OF ELECTRONIC PACKAGING SYSTEMS | 621.381046 M427h2 HANDBOOK OF ELECTRONICS PACKAGING DESIGN AND ENGINEERING | 621.381046 M583T2 MICROELECTRONICS PACKAGING HANDBOOK |
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