Introduction to microsystem packaging technology
By: Jin, Yufeng.
Contributor(s): Wang, Zhiping.
Material type:
BookPublisher: Boca Raton Crc Press 2011Description: xiii, 218p.ISBN: 9781439819104.Subject(s): Microelectronic packingDDC classification: 621.381046 | J564i
| Item type | Current location | Collection | Call number | url | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|---|
Books
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PK Kelkar Library, IIT Kanpur | COMPACT STORAGE (BASEMENT) | 621.381046 J564i (Browse shelf) | Book Request | Available | A170599 |
Total holds: 0
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| 621.381046 EL11 THE ELECTRONIC PACKAGING HANDBOOK | 621.381046 EL25 ELECTRONIC PACKAGING | 621.381046 H191C HANDBOOK FOR CRITICAL CLEANING | 621.381046 J564i Introduction to microsystem packaging technology | 621.381046 L516M MANUFACTURING CHALLENGES IN ELECTRONIC PACKAGING | 621.381046 L74p Power electronic packaging | 621.381046 M199M MECHANICAL ANALYSIS OF ELECTRONIC PACKAGING SYSTEMS |
Includes Bibliographical References And Index
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