MANUFACTURING CHALLENGES IN ELECTRONIC PACKAGING
By: Lee,Y C.
Contributor(s): Chen,W T.
Material type:
BookPublisher: Chapman & Hall, London 1998Description: xi,261.ISBN: 0412620308.Subject(s): Manufacturing Processes | Electronic PackagingDDC classification: 621.381046 | L516M
| Item type | Current location | Collection | Call number | url | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|---|
Books
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PK Kelkar Library, IIT Kanpur | COMPACT STORAGE (BASEMENT) | 621.381046 L516M (Browse shelf) | Book Request | Available | A130608 |
Total holds: 0
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| 621.381046 EL25 ELECTRONIC PACKAGING | 621.381046 H191C HANDBOOK FOR CRITICAL CLEANING | 621.381046 J564i Introduction to microsystem packaging technology | 621.381046 L516M MANUFACTURING CHALLENGES IN ELECTRONIC PACKAGING | 621.381046 L74p Power electronic packaging | 621.381046 M199M MECHANICAL ANALYSIS OF ELECTRONIC PACKAGING SYSTEMS | 621.381046 M427h2 HANDBOOK OF ELECTRONICS PACKAGING DESIGN AND ENGINEERING |
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