CHARACTERIZATION OF INTEGRATED CIRCUIT PACKAGING MATERIALS
By: Thomas M. Moore,Robert G. Mckenna.
Contributor(s): Mckenna,Robert G.
Material type:
BookSeries: Materials Characterization Series. Publisher: Butterworth-Heinemann, Boston c1993Description: xviii 274.ISBN: 0750692677.Subject(s): Electronic Packaging -- Materials | Integrated Circuits -- Design And ConstructionDDC classification: 621.381046 | C37
| Item type | Current location | Collection | Call number | url | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|---|
Books
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PK Kelkar Library, IIT Kanpur | COMPACT STORAGE (BASEMENT) | 621.381046 C37 (Browse shelf) | Book Request | Available | A117898 |
Total holds: 0
Browsing PK Kelkar Library, IIT Kanpur Shelves , Collection code: COMPACT STORAGE (BASEMENT) Close shelf browser
| 621.381045 Y83o Optical electronics | 621.381046 AI71K AIR COOLING TECHNOLOGY FOR ELECTRONIC EQUIPMENT | 621.381046 C334 CERAMIC INTERCONNECT TECHNOLOGY HANDBOOK | 621.381046 C37 CHARACTERIZATION OF INTEGRATED CIRCUIT PACKAGING MATERIALS | 621.381046 D167P PACKAGING OF ELECTRONIC SYSTEMS | 621.381046 EL11 THE ELECTRONIC PACKAGING HANDBOOK | 621.381046 EL25 ELECTRONIC PACKAGING |
Includes Index.
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