ENCAPSULATION OF ELECTRONIC DEVICES AND COMPONENTS
By: Salmon, Edward R.
Material type: BookSeries: Electrical Engineering And Electronics 36. Publisher: New York Marcel Dekker 1987Description: xii,223.Subject(s): Electronic Apparatus And Appliances -- Plastic EmbedmentDDC classification: 621.381046 | Sa35eItem type | Current location | Collection | Call number | url | Status | Date due | Barcode | Item holds |
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Books | PK Kelkar Library, IIT Kanpur | COMPACT STORAGE (BASEMENT) | 621.381046 Sa35e (Browse shelf) | Book Request | Available | A97619 |
Total holds: 0
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621.381046 M583T2 MICROELECTRONICS PACKAGING HANDBOOK | 621.381046 N157 Nano-bio-electronic, photonic and MEMS packaging | 621.381046 P769 POLYMERIC MATERIALS FOR ELECTRONICS PACKAGING AND INTERCONNECTION | 621.381046 Sa35e ENCAPSULATION OF ELECTRONIC DEVICES AND COMPONENTS | 621.381046 Se52t TRANSPORT PACKGING FOR RADIOACTIVE MATERIALS | 621.38105 T624 TOPICS IN ELECTRONICS | 621.38106 Sy6i INFORMATION THEORY |
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