The science and engineering of microelectronic fabrication (Record no. 558968)
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fixed length control field | 02401nam a22002297a 4500 |
005 - DATE AND TIME OF LATEST TRANSACTION | |
control field | 20180528131909.0 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 180525b xxu||||| |||| 00| 0 eng d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
ISBN | 9780195136050 |
040 ## - CATALOGING SOURCE | |
Transcribing agency | IIT Kanpur |
041 ## - LANGUAGE CODE | |
Language code of text/sound track or separate title | eng |
082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
Classification number | 621.38152 |
Item number | C152s2 |
100 ## - MAIN ENTRY--AUTHOR NAME | |
Personal name | Campbell, Stephen A. |
245 ## - TITLE STATEMENT | |
Title | The science and engineering of microelectronic fabrication |
Statement of responsibility, etc | Stephen A. Campbell |
250 ## - EDITION STATEMENT | |
Edition statement | 2nd ed. |
260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
Place of publication | New York |
Name of publisher | Oxford University Press |
Year of publication | 2001 |
300 ## - PHYSICAL DESCRIPTION | |
Number of Pages | xiv, 603p |
440 ## - SERIES STATEMENT/ADDED ENTRY--TITLE | |
Title | The Oxford series in electrical engineering / edited by Adel S. Sedra |
520 ## - SUMMARY, ETC. | |
Summary, etc | The Science and Engineering of Microelectronic Fabrication provides a thorough introduction to the field of microelectronic processing. Geared toward a wide audience, it may be used for upper-level undergraduate or first year graduate courses and as a handy reference for professionals. The text covers all the basic unit processes used to fabricate integrated circuits, including photolithography, plasma and reactive ion etching, ion implantation, diffusin, oxidation, evaporation, vapor phase epitaxial growth, sputtering, and chemical vapor deposition. Advanced processing topics such as rapid thermal processing, non-optical lithography, molecular beam epitaxy, and metal organic chemica vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacturing of integrated circuits. The text also discusses the itnegration of these processes into common technologies such as CMOS, double poly bipolar, and GaAs MESFETs. Complexity/performance tradeoffs are evaluated along with a description of the current state-of-the-art devices. Each chapter includes sample problems with solutions. The text makes use of the process simulation package SUPREM to demonstrate impurity profiles of practical interest. The new edition includes complete chapter coverage of MEMS including: Fundamentals of Mechanics, Stress in Thin Films, Mechanical to Electrical Transduction, Mechanics of Common MEMS Devices, Bulk Micromachining Etching Techniques, Bulk Micromachining Process Flow, Surface Micromachining Basics, Surface Micromachining Process Flow, MEMS Actuators, High Aspect Ratio Microsystems Technology (HARMST). |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical Term | Semiconductors -- Design and construction |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical Term | Microelectronics |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Koha item type | Books |
Withdrawn status | Lost status | Damaged status | Not for loan | Collection code | Permanent Location | Current Location | Date acquired | Full call number | Accession Number | Koha item type |
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General Stacks | PK Kelkar Library, IIT Kanpur | PK Kelkar Library, IIT Kanpur | 2018-05-25 | 621.38152 C152s2 | GB1219 | Books |