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The science and engineering of microelectronic fabrication (Record no. 558968)

000 -LEADER
fixed length control field 02401nam a22002297a 4500
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20180528131909.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 180525b xxu||||| |||| 00| 0 eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
ISBN 9780195136050
040 ## - CATALOGING SOURCE
Transcribing agency IIT Kanpur
041 ## - LANGUAGE CODE
Language code of text/sound track or separate title eng
082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.38152
Item number C152s2
100 ## - MAIN ENTRY--AUTHOR NAME
Personal name Campbell, Stephen A.
245 ## - TITLE STATEMENT
Title The science and engineering of microelectronic fabrication
Statement of responsibility, etc Stephen A. Campbell
250 ## - EDITION STATEMENT
Edition statement 2nd ed.
260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT)
Place of publication New York
Name of publisher Oxford University Press
Year of publication 2001
300 ## - PHYSICAL DESCRIPTION
Number of Pages xiv, 603p
440 ## - SERIES STATEMENT/ADDED ENTRY--TITLE
Title The Oxford series in electrical engineering / edited by Adel S. Sedra
520 ## - SUMMARY, ETC.
Summary, etc The Science and Engineering of Microelectronic Fabrication provides a thorough introduction to the field of microelectronic processing. Geared toward a wide audience, it may be used for upper-level undergraduate or first year graduate courses and as a handy reference for professionals. The text covers all the basic unit processes used to fabricate integrated circuits, including photolithography, plasma and reactive ion etching, ion implantation, diffusin, oxidation, evaporation, vapor phase epitaxial growth, sputtering, and chemical vapor deposition. Advanced processing topics such as rapid thermal processing, non-optical lithography, molecular beam epitaxy, and metal organic chemica vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacturing of integrated circuits. The text also discusses the itnegration of these processes into common technologies such as CMOS, double poly bipolar, and GaAs MESFETs. Complexity/performance tradeoffs are evaluated along with a description of the current state-of-the-art devices. Each chapter includes sample problems with solutions. The text makes use of the process simulation package SUPREM to demonstrate impurity profiles of practical interest. The new edition includes complete chapter coverage of MEMS including: Fundamentals of Mechanics, Stress in Thin Films, Mechanical to Electrical Transduction, Mechanics of Common MEMS Devices, Bulk Micromachining Etching Techniques, Bulk Micromachining Process Flow, Surface Micromachining Basics, Surface Micromachining Process Flow, MEMS Actuators, High Aspect Ratio Microsystems Technology (HARMST).
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical Term Semiconductors -- Design and construction
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical Term Microelectronics
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type Books
Holdings
Withdrawn status Lost status Damaged status Not for loan Collection code Permanent Location Current Location Date acquired Full call number Accession Number Koha item type
        General Stacks PK Kelkar Library, IIT Kanpur PK Kelkar Library, IIT Kanpur 2018-05-25 621.38152 C152s2 GB1219 Books

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