| 000 -LEADER |
|---|
| fixed length control field |
04258nam a22004935i 4500 |
| 001 - CONTROL NUMBER |
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| control field |
978-0-387-47326-0 |
| 003 - CONTROL NUMBER IDENTIFIER |
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| control field |
DE-He213 |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
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| control field |
20161121231135.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
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| fixed length control field |
cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
|---|
| fixed length control field |
100301s2008 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9780387473260 |
| -- |
978-0-387-47326-0 |
| 024 7# - OTHER STANDARD IDENTIFIER |
|---|
| Standard number or code |
10.1007/978-0-387-47325-3 |
| Source of number or code |
doi |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER |
|---|
| Classification number |
T174.7 |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER |
|---|
| Classification number |
TA418.9.N35 |
| 072 #7 - SUBJECT CATEGORY CODE |
|---|
| Subject category code |
TBN |
| Source |
bicssc |
| 072 #7 - SUBJECT CATEGORY CODE |
|---|
| Subject category code |
TEC027000 |
| Source |
bisacsh |
| 072 #7 - SUBJECT CATEGORY CODE |
|---|
| Subject category code |
SCI050000 |
| Source |
bisacsh |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
|---|
| Classification number |
620.115 |
| Edition number |
23 |
| 245 10 - TITLE STATEMENT |
|---|
| Title |
Nanopackaging |
| Medium |
[electronic resource] : |
| Remainder of title |
Nanotechnologies and Electronics Packaging / |
| Statement of responsibility, etc. |
edited by James E. Morris. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
|---|
| Place of production, publication, distribution, manufacture |
Boston, MA : |
| Name of producer, publisher, distributor, manufacturer |
Springer US : |
| -- |
Imprint: Springer, |
| Date of production, publication, distribution, manufacture, or copyright notice |
2008. |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
XXI, 543 p. |
| Other physical details |
online resource. |
| 336 ## - CONTENT TYPE |
|---|
| Content type term |
text |
| Content type code |
txt |
| Source |
rdacontent |
| 337 ## - MEDIA TYPE |
|---|
| Media type term |
computer |
| Media type code |
c |
| Source |
rdamedia |
| 338 ## - CARRIER TYPE |
|---|
| Carrier type term |
online resource |
| Carrier type code |
cr |
| Source |
rdacarrier |
| 347 ## - DIGITAL FILE CHARACTERISTICS |
|---|
| File type |
text file |
| Encoding format |
PDF |
| Source |
rda |
| 505 0# - FORMATTED CONTENTS NOTE |
|---|
| Formatted contents note |
Nanopackaging: Nanotechnologies and Electronics Packaging -- Modelling Technologies and Applications -- Application of Molecular Dynamics Simulation in Electronic Packaging -- Advances in Delamination Modeling -- Nanoparticle Properties -- Nanoparticle Fabrication -- Nanoparticle-Based High-k Dielectric Composites: Opportunities and Challenges -- Nanostructured Resistor Materials -- Nanogranular Magnetic Core Inductors: Design, Fabrication, and Packaging -- Nanoconductive Adhesives -- Nanoparticles in Microvias -- Materials and Technology for Conductive Microstructures -- A Study of Nanoparticles in SnAg-Based Lead-Free Solders -- Nano-Underfills for Fine-Pitch Electronics -- Carbon Nanotubes: Synthesis and Characterization -- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications -- Carbon Nanotubes for Thermal Management of Microsystems -- Electromagnetic Shielding of Transceiver Packaging Using Multiwall Carbon Nanotubes -- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes -- Nanowires in Electronics Packaging -- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging -- Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities -- Nanoelectronics Landscape: Application, Technology, and Economy -- Errata. |
| 520 ## - SUMMARY, ETC. |
|---|
| Summary, etc. |
Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. Nanopackaging: Nanotechnologies and Electronics Packaging is an important reference for Industrial and academic researchers as well as practicing engineers seeking information about the latest techniques, including: The importance of computer modeling in nanopackaging and offers suggestions for implementation Carbon Nanotubes and Nanoparticles, and their role in packaging, including basic properties and fabrication, and applications in solder, thermal management, and EMI control A comprehensive overview of nanoscale electronics and systems packaging Nanopackaging: Nanotechnologies and Electronics Packaging is an ideal reference for researchers, practicing engineers as well as graduate students who are either entering the field of for the first time, or those already conducting research and want to expand their knowledge in the field of nanopackaging. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Materials science. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Electrochemistry. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Electronics. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Microelectronics. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Nanotechnology. |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Materials Science. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Nanotechnology. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Electrochemistry. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Electronics and Microelectronics, Instrumentation. |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Morris, James E. |
| Relator term |
editor. |
| 710 2# - ADDED ENTRY--CORPORATE NAME |
|---|
| Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY |
|---|
| Title |
Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
|---|
| Relationship information |
Printed edition: |
| International Standard Book Number |
9780387473253 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS |
|---|
| Uniform Resource Identifier |
http://dx.doi.org/10.1007/978-0-387-47325-3 |
| 912 ## - |
|---|
| -- |
ZDB-2-CMS |
