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Nanomechanics of Materials and Structures (Record no. 508538)

000 -LEADER
fixed length control field 05255nam a22004815i 4500
001 - CONTROL NUMBER
control field 978-1-4020-3951-5
003 - CONTROL NUMBER IDENTIFIER
control field DE-He213
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20161121231110.0
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr nn 008mamaa
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 100301s2006 ne | s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9781402039515
-- 978-1-4020-3951-5
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1007/1-4020-3951-4
Source of number or code doi
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TK7800-8360
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TK7874-7874.9
072 #7 - SUBJECT CATEGORY CODE
Subject category code TJF
Source bicssc
072 #7 - SUBJECT CATEGORY CODE
Subject category code TEC008000
Source bisacsh
072 #7 - SUBJECT CATEGORY CODE
Subject category code TEC008070
Source bisacsh
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.381
Edition number 23
245 10 - TITLE STATEMENT
Title Nanomechanics of Materials and Structures
Medium [electronic resource] /
Statement of responsibility, etc. edited by T. -J. Chuang, P. M. Anderson, M. -K. Wu, S. Hsieh.
264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE
Place of production, publication, distribution, manufacture Dordrecht :
Name of producer, publisher, distributor, manufacturer Springer Netherlands,
Date of production, publication, distribution, manufacture, or copyright notice 2006.
300 ## - PHYSICAL DESCRIPTION
Extent XVIII, 324 p.
Other physical details online resource.
336 ## - CONTENT TYPE
Content type term text
Content type code txt
Source rdacontent
337 ## - MEDIA TYPE
Media type term computer
Media type code c
Source rdamedia
338 ## - CARRIER TYPE
Carrier type term online resource
Carrier type code cr
Source rdacarrier
347 ## - DIGITAL FILE CHARACTERISTICS
File type text file
Encoding format PDF
Source rda
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note Summary of Group Discussions -- Nano Mechanics/Materials Research -- An Ab-Initio Study of Mechanical Behavior for (A?-O)n Nanorods -- Phase Field Modeling of Solidification and Melting of a Confined Nano-Particle -- Friction-Induced Nucleation of Nanocrystals -- Modeling of Carbon Nanotubes and Their Composites -- On the Tensile Strength of a Solid Nanowire -- Fracture Nucleation in Single-Wall Carbon Nanotubes -- Multiscale Modeling of a Germanium Quantum Dot in Silicon -- Nanomechanics of Biological Single Crystals -- Nano/Micro Fluidic Systems -- Mechanical Characterization of a Single Nanofiber -- Atomistic Studies of Flaw Tolerant Nanoscale Structural Links in Biological Materials -- Towards the Integration of Nano/Micro Devices Using MEMS Technology -- Atomic Scale Mechanisms of Stress Production in Elastomers -- Dynamic Indentation of Polymers Using the Atomic Force Microscope -- Fabrication and Simulation of Nanostructures on Silicon by Laser Assisted Direct Imprint Technique -- Structure and Stress Evolution Due to Medium Energy Ion Bombardment of Silicon -- Mechanics of Nanostructures -- Residual Stresses in Nano-Film/Substrate Systems -- Nanomechanics of Crack Front Mobility -- Finite Temperature Coupled Atomistic/Continuum Discrete Dislocation Dynamics Simulation of Nanoindentation -- Static Atomistic Simulations of Nanoindentation and Determination of Nanohardness -- Electric Field-Directed Patterning of Molecules on a Solid Surface -- Dynamics of Dislocations in Thin Colloidal Crystals -- Mesoscopic Length Scales for Deformed Nanostructures -- Rough Surface Plasticity and Adhesion across Length Scales -- Modeling the Effect of Texture on the Deformation Mechanisms of Nanocrystalline Materials at the Atomistic Scale -- Modeling the Tribochemical Aspects of Friction and Gradual Wear of DLC Films.
520 ## - SUMMARY, ETC.
Summary, etc. This book is derived from the proceedings of the International Workshop on Nanomechanics held at Asilomar Conference Grounds in Pacific Grove, California on July 14-17, 2004. Approximately 70 leading experts from academia, government and industrial sectors in semiconductors, computers, communication, information technology, defense, energy, transportation and aerospace attended the Workshop (see the workshop photo taken on July 16, 2004). The main objective was to convene leading researchers in the nanotechnology community to assess the current state-of-the-art and disseminate recent progress, critical issues, barriers to applications, and directions for future research in nanomechanics. Miniaturization of structural components and functional devices such as electronic, optical, mechanical and electric-magnetic parts has been a recent trend, and the pace has accelerated over the past few years. Advances in micromanufacturing, semiconductor processing (e.g., etching, lithography, grafting, etc.), sensors, actuators and microprocessors have opened up a revolutionary path to the development of new technologies such as micro-electro-mechanical systems (MEMS), nano-electro-mechanical systems (NEMS), micro-engines, smart structures, smart controllers, lab-- a-chip devices, and even bio-medical sensing devices which can detect, analyze, decide and activate appropriate functions in real time. The above-mentioned devices, structures, or systems, have one issue in common. In order to perform their assigned functions, they must maintain their structural integrity and be reliable and durable during their entire designed service life. Thus, strength, durability, and time-dependent mechanical property degradation are major concerns for design engineers and device manufacturers, even though the parts are designed for electronic, magnetic, optical or other functions.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Engineering.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Electronics.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Microelectronics.
650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Engineering.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Electronics and Microelectronics, Instrumentation.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Chuang, T. -J.
Relator term editor.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Anderson, P. M.
Relator term editor.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Wu, M. -K.
Relator term editor.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Hsieh, S.
Relator term editor.
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element SpringerLink (Online service)
773 0# - HOST ITEM ENTRY
Title Springer eBooks
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Relationship information Printed edition:
International Standard Book Number 9781402039508
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier http://dx.doi.org/10.1007/1-4020-3951-4
912 ## -
-- ZDB-2-ENG
Holdings
Withdrawn status Lost status Damaged status Not for loan Permanent Location Current Location Date acquired Barcode Date last seen Price effective from Koha item type
        PK Kelkar Library, IIT Kanpur PK Kelkar Library, IIT Kanpur 2016-11-21 EBK8825 2016-11-21 2016-11-21 E books

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